DDR-003
3-R-II-C+VI
Stage B:
Numerous die scratches Northeast across Reverse EMDS
Die crack across lower shoulder LDS
Die crack across lower lapel
Stage C:
Die chip on lower T of CENT MDS
Obverse is LDS
Stage D:
Die crack from the first U of PLURIBUS Southeast to the N of ONE
LDS
Obverse die changed EDS
Stage E:
Die crack extends from N of ONE to N of CENT LDS
Die break on and to the Right side of the stem of T of CENT
Die crack from upper O of ONE Southwest to Left wheat edge
Die chip in lower Left wheat grains
Strong die crack lower Right wheat to rim
Light die crack across upper E of ONE
Light die crack across lower lapel MDS
Reported By:
David Lindahl
US Mint:
Philadelphia